Cometₓ-SSP

Cleaving for Single Step Polishing

 

Cometₓ-SSP Results

 

SSP Benefits

EXISTING CLEAVING TECHNIQUES

– Multiple polishing steps (3-4)
– Varying quality of manual cleaving (operatior/tool dependent)
– Core cracks and end face chips
– Large epoxy bead size
– Time consuming polishing process (around 5 min/batch)
– Higher costs (equipment, acquisition & maintenance, polishing materials)
– Lower yield and throughput

COMETₓ-SSP

– Single polishing step
– Laser cleaving eliminates operator/tool dependent cleave quality
– Eliminates cleave related multimode fiber core cracking
– Minimal epoxy “pond” left
– Short and simple polishing process (around 1 min/batch)
– Minimal use of polishing equipment and materials
– Higher yield and throughput; Remove interdependencies

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