SSP Benefits
EXISTING CLEAVING TECHNIQUES
- Multiple polishing steps (3-4)
- Varying quality of manual cleaving (operatior/tool dependent)
- Core cracks and end face chips
- Large epoxy bead size
- Time consuming polishing process (around 5 min/batch)
- Higher costs (equipment, acquisition & maintenance, polishing materials)
- Lower yield and throughput
COMETₓ-SSP
- Single polishing step
- Laser cleaving eliminates operator/tool dependent cleave quality
- Eliminates cleave related multimode fiber core cracking
- Minimal epoxy “pond” left
- Short and simple polishing process (around 1 min/batch)
- Minimal use of polishing equipment and materials
- Higher yield and throughput; Remove interdependencies